Kev hloov pauv thiab kev vam meej ntawm CPOoptoelectronickev siv tshuab ua ke ntim khoom
Kev ntim khoom siv Optoelectronic tsis yog ib qho thev naus laus zis tshiab, nws txoj kev loj hlob tuaj yeem taug qab rov qab mus rau xyoo 1960, tab sis lub sijhawm no, kev ntim khoom siv photoelectric tsuas yog ib pob khoom yooj yim ntawmcov khoom siv hluav taws xob optoelectronicua ke. Los ntawm xyoo 1990, nrog rau kev sawv ntawmkev sib txuas lus kho qhov muagkev lag luam, photoelectric copackaging pib tshwm sim. Nrog rau kev tawg ntawm lub zog suav siab thiab kev thov bandwidth siab xyoo no, photoelectric co-packaging, thiab nws cov ceg thev naus laus zis cuam tshuam, tau txais kev saib xyuas ntau dua ib zaug ntxiv.
Hauv kev txhim kho thev naus laus zis, txhua theem kuj muaj ntau hom sib txawv, los ntawm 2.5D CPO sib raug rau 20/50Tb/s qhov xav tau, mus rau 2.5D Chiplet CPO sib raug rau 50/100Tb/s qhov xav tau, thiab thaum kawg ua tiav 3D CPO sib raug rau 100Tb/s tus nqi.
Cov pob khoom 2.5D CPOkho qhov muag modulethiab lub network switch chip rau ntawm tib lub substrate kom luv qhov deb ntawm kab thiab ua rau I/O ceev dua, thiab 3D CPO txuas ncaj qha rau lub optical IC rau txheej nruab nrab kom ua tiav qhov kev sib txuas ntawm I/O suab tsawg dua 50um. Lub hom phiaj ntawm nws txoj kev hloov pauv yog qhov tseeb heev, uas yog kom txo qhov deb ntawm lub photoelectric conversion module thiab lub network switching chip ntau li ntau tau.
Tam sim no, CPO tseem nyob rau hauv nws cov menyuam yaus, thiab tseem muaj teeb meem xws li cov qoob loo qis thiab cov nqi kho siab, thiab ob peb lub tuam txhab tsim khoom hauv kev ua lag luam tuaj yeem muab cov khoom lag luam ntsig txog CPO tag nrho. Tsuas yog Broadcom, Marvell, Intel, thiab ob peb lub tuam txhab ua si muaj cov kev daws teeb meem tshwj xeeb hauv kev ua lag luam.
Xyoo tas los Marvell tau qhia txog 2.5D CPO technology switch siv VIA-LAST process. Tom qab ua tiav cov silicon optical chip, TSV raug ua tiav nrog lub peev xwm ua tiav ntawm OSAT, thiab tom qab ntawd ntxiv cov electrical chip flip-chip rau hauv silicon optical chip. 16 optical modules thiab switching chip Marvell Teralynx7 tau sib txuas ua ke ntawm PCB los ua ib lub switch, uas tuaj yeem ua tiav qhov hloov pauv ntawm 12.8Tbps.
Xyoo no ntawm OFC, Broadcom thiab Marvell kuj tau ua qauv qhia txog tiam tshiab kawg ntawm 51.2Tbps switch chips siv cov thev naus laus zis optoelectronic co-packaging.
Los ntawm Broadcom cov tiam tshiab ntawm CPO cov ntsiab lus kev siv tshuab, CPO 3D pob los ntawm kev txhim kho cov txheej txheem kom ua tiav qhov siab dua I / O ceev, CPO siv hluav taws xob mus rau 5.5W / 800G, qhov sib piv ntawm kev siv hluav taws xob zoo heev thiab kev ua tau zoo heev. Tib lub sijhawm, Broadcom kuj tseem tawg mus rau ib nthwv dej ntawm 200Gbps thiab 102.4T CPO.
Cisco kuj tau nce nws cov peev nyiaj rau hauv CPO thev naus laus zis, thiab tau ua qhov kev qhia txog cov khoom CPO hauv OFC xyoo no, qhia txog nws cov thev naus laus zis CPO uas tau khaws cia thiab siv rau ntawm lub multiplexer / demultiplexer uas sib xyaw ua ke ntau dua. Cisco tau hais tias nws yuav ua qhov kev sim xa CPO hauv 51.2Tb switches, tom qab ntawd los ntawm kev siv loj hauv 102.4Tb switch cycles.
Intel tau tsim cov CPO raws li cov keyboards ntev lawm, thiab nyob rau xyoo tas los no Intel tau txuas ntxiv ua haujlwm nrog Ayar Labs los tshawb nrhiav cov kev daws teeb meem sib txuas lus bandwidth siab dua, uas yog txoj hauv kev rau kev tsim cov khoom siv optoelectronic co-packaging thiab optical interconnect devices ntau heev.
Txawm hais tias cov modules pluggable tseem yog thawj qhov kev xaiv, qhov kev txhim kho kev siv hluav taws xob tag nrho uas CPO tuaj yeem coj los tau nyiam ntau thiab ntau tus neeg tsim khoom. Raws li LightCounting, cov khoom xa tuaj ntawm CPO yuav pib nce ntxiv ntau los ntawm 800G thiab 1.6T chaw nres nkoj, maj mam pib muaj nyob rau hauv kev lag luam los ntawm 2024 txog 2025, thiab tsim ib qho ntim loj los ntawm 2026 txog 2027. Tib lub sijhawm, CIR xav tias cov nyiaj tau los ntawm kev lag luam ntawm photoelectric tag nrho cov ntim yuav ncav cuag $ 5.4 billion hauv xyoo 2027.
Thaum ntxov xyoo no, TSMC tshaj tawm tias nws yuav koom tes nrog Broadcom, Nvidia thiab lwm tus neeg siv khoom loj los sib koom ua ke tsim cov thev naus laus zis silicon photonics, cov khoom siv ntim khoom optical CPO thiab lwm yam khoom tshiab, cov txheej txheem thev naus laus zis los ntawm 45nm txog 7nm, thiab hais tias qhov ceev tshaj plaws ib nrab ntawm xyoo tom ntej pib ua kom tau raws li qhov kev txiav txim loj, 2025 lossis yog li ntawd kom mus txog theem ntim.
Ua ib qho kev siv tshuab sib txuas lus uas muaj cov khoom siv photonic, cov circuits sib xyaw ua ke, kev ntim khoom, kev ua qauv thiab kev simulation, CPO thev naus laus zis qhia txog kev hloov pauv los ntawm optoelectronic fusion, thiab kev hloov pauv coj los rau kev xa cov ntaub ntawv yog qhov tsis muaj kev cuam tshuam. Txawm hais tias daim ntawv thov ntawm CPO tsuas yog pom hauv cov chaw khaws ntaub ntawv loj rau lub sijhawm ntev, nrog rau kev nthuav dav ntxiv ntawm lub zog suav loj thiab cov kev xav tau bandwidth siab, CPO photoelectric co-seal thev naus laus zis tau dhau los ua ib qho chaw sib ntaus sib tua tshiab.
Nws tuaj yeem pom tias cov chaw tsim khoom ua haujlwm hauv CPO feem ntau ntseeg tias xyoo 2025 yuav yog lub node tseem ceeb, uas kuj yog lub node nrog tus nqi pauv ntawm 102.4Tbps, thiab qhov tsis zoo ntawm cov modules pluggable yuav raug nthuav dav ntxiv. Txawm hais tias cov ntawv thov CPO yuav tuaj qeeb qeeb, opto-electronic co-packaging yog qhov tsis ntseeg tib txoj hauv kev los ua tiav kev kub ceev, bandwidth siab thiab qis zog networks.
Lub sijhawm tshaj tawm: Plaub Hlis-02-2024