Evolution thiab kev nce qib ntawm CPOoptoelectronicco-packaging technology
Optoelectronic co-packaging tsis yog lub tshuab tshiab, nws txoj kev loj hlob tuaj yeem taug qab mus rau xyoo 1960, tab sis lub sijhawm no, photoelectric co-packaging tsuas yog ib pob yooj yim ntawmcov khoom siv optoelectronicua ke. Los ntawm 1990s, nrog nce ntawm luboptical kev sib txuas lus modulekev lag luam, photoelectric copackaging pib tshwm. Nrog lub tshuab hluav taws xob siv hluav taws xob siab thiab kev xav tau siab bandwidth xyoo no, photoelectric co-packaging, thiab nws cov cuab yeej cuab tam cuam tshuam, tau txais kev saib xyuas ntau dua.
Hauv kev tsim cov thev naus laus zis, txhua theem kuj muaj cov qauv sib txawv, los ntawm 2.5D CPO sib raug rau 20/50Tb / s xav tau, mus rau 2.5D Chiplet CPO sib xws rau 50/100Tb / s xav tau, thiab thaum kawg paub 3D CPO sib haum rau 100Tb / s tus nqi.
Lub 2.5D CPO ntim covkho qhov muag modulethiab lub network hloov nti ntawm tib lub substrate kom luv txoj kab nrug thiab nce qhov I / O ceev, thiab 3D CPO ncaj qha txuas cov kho qhov muag IC mus rau txheej nruab nrab kom ua tiav qhov kev sib tshuam ntawm I / O pitch tsawg dua 50um. Lub hom phiaj ntawm nws cov evolution yog qhov tseeb heev, uas yog los txo qhov kev ncua deb ntawm photoelectric hloov dua siab tshiab module thiab lub network switching nti kom ntau li ntau tau.
Tam sim no, CPO tseem nyob rau hauv nws cov me nyuam mos, thiab tseem muaj teeb meem xws li cov khoom lag luam qis thiab cov nqi kho mob siab, thiab ob peb lub khw muag khoom tuaj yeem muab cov khoom lag luam CPO tag nrho. Tsuas yog Broadcom, Marvell, Intel, thiab ib tug puv tes ntawm lwm tus players muaj tag nrho cov tswv cuab ntawm lub khw.
Marvell tau qhia txog 2.5D CPO thev naus laus zis hloov pauv siv VIA-LAST txheej txheem xyoo tas los. Tom qab lub silicon optical nti ua tiav, TSV tau ua tiav nrog kev ua haujlwm ntawm OSAT, thiab tom qab ntawd cov hluav taws xob nti flip-chip ntxiv rau silicon optical nti. 16 kho qhov muag modules thiab hloov nti Marvell Teralynx7 yog kev sib txuas ntawm PCB los tsim ib qho kev hloov, uas tuaj yeem ua tiav qhov hloov pauv ntawm 12.8Tbps.
Ntawm xyoo no OFC, Broadcom thiab Marvell kuj tau qhia txog tiam tshiab ntawm 51.2Tbps hloov chips siv optoelectronic co-packaging technology.
Los ntawm Broadcom lub cim tshiab ntawm CPO cov ntsiab lus, CPO 3D pob los ntawm kev txhim kho cov txheej txheem kom ua tiav qhov siab dua I / O, CPO zog siv rau 5.5W / 800G, lub zog efficiency piv yog qhov ua tau zoo heev. Tib lub sijhawm, Broadcom tseem tab tom tawg mus rau ib nthwv dej ntawm 200Gbps thiab 102.4T CPO.
Cisco kuj tau nce nws cov peev txheej hauv CPO thev naus laus zis, thiab ua rau CPO cov khoom lag luam ua qauv qhia hauv OFC xyoo no, qhia txog nws cov CPO thev naus laus zis sib sau thiab daim ntawv thov ntawm kev sib koom ua ke ntau dua / demultiplexer. Cisco tau hais tias nws yuav ua qhov kev sim ua haujlwm ntawm CPO hauv 51.2Tb hloov pauv, ua raws li kev coj ua loj hauv 102.4Tb hloov mus.
Intel tau ntev tau qhia CPO raws li cov keyboards, thiab nyob rau hauv xyoo tas los Intel tau txuas ntxiv ua haujlwm nrog Ayar Labs los tshawb nrhiav kev sib koom ua ke ntau dua bandwidth teeb liab sib cuam tshuam kev daws teeb meem, paving txoj hauv kev rau kev tsim khoom loj ntawm optoelectronic co-packaging thiab optical interconnect li.
Txawm hais tias pluggable modules tseem yog thawj qhov kev xaiv, qhov kev txhim kho lub zog tag nrho uas CPO tuaj yeem nqa tau nyiam ntau thiab ntau lub tuam txhab. Raws li LightCounting, CPO cov khoom xa tuaj yuav pib nce ntxiv los ntawm 800G thiab 1.6T cov chaw nres nkoj, maj mam pib ua lag luam los ntawm 2024 txog 2025, thiab tsim cov ntim loj los ntawm 2026 txog 2027. Tib lub sijhawm, CIR cia siab tias cov kev lag luam cov nyiaj tau los ntawm photoelectric tag nrho ntim yuav ncav cuag $ 5.4 billion hauv 2027.
Nyuam qhuav pib lub xyoo no, TSMC tshaj tawm tias nws yuav koom tes nrog Broadcom, Nvidia thiab lwm cov neeg siv khoom loj los koom ua ke tsim silicon photonics thev naus laus zis, kev ntim khoom siv kho qhov muag CPO thiab lwm yam khoom tshiab, txheej txheem thev naus laus zis los ntawm 45nm mus rau 7nm, thiab hais tias qhov ceev tshaj plaws thib ob ib nrab. ntawm xyoo tom ntej pib ua kom tau raws li qhov kev txiav txim loj, 2025 lossis li ntawd kom mus txog theem ntim.
Raws li kev sib koom tes thev naus laus zis suav nrog cov khoom siv photonic, kev sib xyaw ua ke, ntim, qauv thiab simulation, CPO thev naus laus zis qhia txog cov kev hloov pauv coj los ntawm optoelectronic fusion, thiab cov kev hloov pauv coj mus rau cov ntaub ntawv xa mus yog undoubtedly subversive. Txawm hais tias daim ntawv thov ntawm CPO tsuas yog pom nyob rau hauv cov ntaub ntawv loj loj rau lub sijhawm ntev, nrog rau kev nthuav dav ntxiv ntawm kev siv hluav taws xob loj thiab cov kev xav tau siab bandwidth, CPO photoelectric co-seal thev naus laus zis tau dhau los ua kev sib ntaus sib tua tshiab.
Nws tuaj yeem pom tau tias cov tuam txhab ua haujlwm hauv CPO feem ntau ntseeg tias 2025 yuav yog ib qho tseem ceeb ntawm cov node, uas tseem yog ib qho ntawm tus nqi sib pauv ntawm 102.4Tbps, thiab qhov tsis zoo ntawm cov pluggable modules yuav raug nthuav dav ntxiv. Txawm hais tias CPO daim ntawv thov tuaj yeem maj mam, opto-electronic co-packaging yog undoubtedly tib txoj kev kom ua tiav kev kub ceev, siab bandwidth thiab qis zog tes hauj lwm.
Post lub sij hawm: Apr-02-2024