Optoelectronic integration method

Optoelectronickev koom ua ke

Kev koom ua ke ntawmphotonicsthiab cov khoom siv hluav taws xob yog cov kauj ruam tseem ceeb hauv kev txhim kho lub peev xwm ntawm cov ntaub ntawv ua cov txheej txheem, ua kom cov ntaub ntawv hloov pauv sai dua, kev siv hluav taws xob qis dua thiab tsim cov cuab yeej siv ntau dua, thiab qhib lub sijhawm tshiab loj rau kev tsim qauv. Kev sib xyaw ua ke feem ntau muab faib ua ob pawg: kev sib koom ua ke monolithic thiab kev sib koom ua ke ntawm ntau lub chip.

Monolithic kev koom ua ke
Monolithic kev koom ua ke suav nrog kev tsim cov khoom siv hluav taws xob thiab cov khoom siv hluav taws xob ntawm tib lub substrate, feem ntau yog siv cov ntaub ntawv sib xws thiab cov txheej txheem. Txoj hauv kev no tsom mus rau kev tsim kom muaj kev sib txuas sib txuas ntawm lub teeb thiab hluav taws xob hauv ib nti.
Qhov zoo:
1. Txo cov kev sib txuas tsis sib xws: Muab cov photons thiab cov khoom siv hluav taws xob tso rau hauv qhov sib ze kom txo qis cov teeb liab poob cuam tshuam nrog kev sib txuas off-chip.
2, Txhim kho kev ua tau zoo: Kev sib xyaw ua ke tuaj yeem ua rau cov ntaub ntawv hloov pauv sai dua vim muaj cov teeb liab luv luv thiab txo latency.
3, me me: Monolithic kev koom ua ke tso cai rau cov khoom siv compact, uas tshwj xeeb tshaj yog muaj txiaj ntsig zoo rau qhov chaw txwv tsis pub siv, xws li cov chaw khaws ntaub ntawv lossis cov khoom siv tes tuav.
4, txo kev siv hluav taws xob: tshem tawm qhov xav tau ntawm cov pob khoom sib cais thiab kev sib txuas mus ntev, uas tuaj yeem txo cov kev xav tau ntawm lub zog.
Kev sib tw:
1) Cov khoom siv sib xws: Nrhiav cov ntaub ntawv uas txhawb nqa ob qho tib si zoo electrons thiab photonic zog tuaj yeem nyuaj vim lawv feem ntau xav tau cov khoom sib txawv.
2, txheej txheem kev sib raug zoo: Kev sib koom ua ke ntawm cov txheej txheem tsim khoom sib txawv ntawm cov khoom siv hluav taws xob thiab cov duab hluav taws xob ntawm tib lub substrate yam tsis muaj kev cuam tshuam qhov kev ua tau zoo ntawm ib qho khoom siv yog ib txoj haujlwm nyuaj.
4, Complex manufacturing: Lub siab precision yuav tsum tau rau hluav taws xob thiab photononic qauv tsub kom lub complexity thiab nqi ntawm manufacturing.

Multi-chip kev koom ua ke
Txoj hauv kev no tso cai rau kev hloov pauv ntau dua hauv kev xaiv cov ntaub ntawv thiab cov txheej txheem rau txhua txoj haujlwm. Hauv kev sib koom ua ke no, cov khoom siv hluav taws xob thiab cov khoom siv hluav taws xob yog los ntawm cov txheej txheem sib txawv thiab tom qab ntawd sib sau ua ke thiab muab tso rau hauv ib lub pob lossis cov substrate (Daim duab 1). Tam sim no cia peb sau cov hom kev sib txuas ntawm optoelectronic chips. Kev sib txuas ncaj qha: Cov txheej txheem no suav nrog kev sib cuag ntawm lub cev ncaj qha thiab kev sib txuas ntawm ob qhov chaw, feem ntau yog yooj yim los ntawm molecular bonding rog, kub, thiab siab. Nws muaj qhov zoo ntawm kev yooj yim thiab muaj peev xwm tsis tshua muaj kev sib txuas, tab sis yuav tsum tau ua kom haum thiab huv si. Fiber / grating coupling: Nyob rau hauv cov tswv yim no, cov fiber ntau los yog fiber ntau array yog ua raws thiab sib koom ua ke rau ntawm ntug los yog nto ntawm lub photonic nti, tso cai rau lub teeb ua ke nyob rau hauv thiab tawm ntawm lub nti. Lub grating tseem tuaj yeem siv rau kev sib txuas ntsug, txhim kho kev ua haujlwm ntawm kev sib kis ntawm lub teeb ntawm photonic nti thiab cov fiber ntau sab nraud. Los ntawm-silicon qhov (TSVs) thiab micro-bumps: Los ntawm-silicon qhov yog ntsug interconnects los ntawm silicon substrate, tso cai rau cov chips yuav stacked nyob rau hauv peb qhov ntev. Ua ke nrog cov ntsiab lus micro-convex, lawv pab kom ua tiav kev sib txuas hluav taws xob ntawm cov khoom siv hluav taws xob thiab photonic chips nyob rau hauv cov txheej txheem stacked, haum rau high-density integration. Optical intermediary txheej: Lub optical intermediary txheej yog ib tug nyias substrate uas muaj optical waveguides uas yog ib tug intermediary rau routing optical signals ntawm chips. Nws tso cai rau kom meej meej, thiab ntxiv passiveoptical Cheebtsamtuaj yeem ua ke kom nce kev sib txuas yooj yim. Hybrid bonding: Qhov kev sib koom ua ke zoo tshaj plaws no muab kev sib txuas ncaj qha thiab micro-bump thev naus laus zis kom ua tiav cov hluav taws xob sib txuas ntawm cov chips thiab cov khoom siv kho qhov muag zoo. Nws yog qhov tshwj xeeb cog lus rau kev ua haujlwm siab optoelectronic kev sib koom ua ke. Solder bump bonding: Zoo ib yam li flip chip bonding, solder bumps yog siv los tsim hluav taws xob sib txuas. Txawm li cas los xij, nyob rau hauv cov ntsiab lus ntawm optoelectronic kev koom ua ke, tshwj xeeb yuav tsum tau them nyiaj tshwj xeeb kom tsis txhob muaj kev puas tsuaj rau photonic Cheebtsam tshwm sim los ntawm thermal stress thiab tswj kho qhov muag sib dhos.

Daim duab 1: : Electron/photon chip-to-chip Bonding scheme

Cov txiaj ntsig ntawm cov txheej txheem no yog qhov tseem ceeb: Raws li lub ntiaj teb CMOS txuas ntxiv ua raws li kev txhim kho hauv Moore Txoj Cai, nws yuav tuaj yeem hloov kho txhua tiam ntawm CMOS lossis Bi-CMOS mus rau qhov pheej yig silicon photonic nti, sau cov txiaj ntsig ntawm cov txheej txheem zoo tshaj plaws hauv photonics thiab electronics. Vim tias photonics feem ntau tsis tas yuav tsim cov qauv me me (qhov loj me ntawm li 100 nanometers yog qhov raug) thiab cov khoom siv loj piv rau cov transistors, kev xav txog kev lag luam yuav nyiam thawb cov khoom siv photonic los tsim cov txheej txheem sib cais, sib cais los ntawm cov qib siab. electronics xav tau rau cov khoom kawg.
Qhov zoo:
1, yoog raws: Cov ntaub ntawv sib txawv thiab cov txheej txheem tuaj yeem siv nws tus kheej kom ua tiav qhov kev ua tau zoo tshaj plaws ntawm cov khoom siv hluav taws xob thiab photonic.
2, cov txheej txheem kom loj hlob: kev siv cov txheej txheem tsim khoom lag luam rau txhua yam tuaj yeem ua kom yooj yim ntau lawm thiab txo nqi.
3, Kev txhim kho yooj yim dua thiab kev saib xyuas yooj yim: Kev sib cais ntawm cov khoom tso cai rau ib tus neeg cov khoom hloov pauv lossis hloov kho tau yooj yim dua yam tsis muaj kev cuam tshuam rau tag nrho lub cev.
Kev sib tw:
1, kev sib txuas tsis sib xws: Qhov kev sib txuas tawm ntawm lub chip nthuav qhia ntxiv cov teeb liab poob thiab tej zaum yuav xav tau cov txheej txheem sib dhos nyuaj.
2, nce qhov nyuaj thiab qhov loj: Cov khoom ntawm tus kheej xav tau kev ntim khoom ntxiv thiab kev sib txuas, ua rau muaj qhov loj dua thiab muaj peev xwm ntau dua.
3, kev siv hluav taws xob ntau dua: txoj kev teeb liab ntev dua thiab kev ntim khoom ntxiv tuaj yeem ua rau muaj zog ntxiv rau kev sib koom ua ke ntawm monolithic.
Xaus:
Kev xaiv ntawm monolithic thiab multi-chip kev koom ua ke yog nyob ntawm daim ntawv thov tshwj xeeb, nrog rau cov hom phiaj kev ua tau zoo, qhov loj me, kev xav txog tus nqi, thiab kev loj hlob ntawm thev naus laus zis. Txawm hais tias kev tsim khoom tsis yooj yim, kev sib koom ua ke monolithic yog qhov zoo rau cov ntawv thov uas xav tau kev siv hluav taws xob tsawg, siv hluav taws xob tsawg, thiab cov ntaub ntawv xa mus ceev. Hloov chaw, kev sib koom ua ke ntawm ntau lub chips muaj ntau dua kev tsim qauv yooj yim thiab siv cov peev txheej tsim khoom uas twb muaj lawm, ua rau nws tsim nyog rau cov ntawv thov uas cov xwm txheej no ntau dua cov txiaj ntsig ntawm kev sib koom ua ke nruj dua. Raws li kev tshawb fawb txuas ntxiv mus, hybrid txoj hauv kev uas muab cov ntsiab lus ntawm ob lub tswv yim tseem tab tom tshawb nrhiav los txhim kho kev ua haujlwm zoo thaum txo cov teeb meem cuam tshuam nrog txhua txoj hauv kev.